Message from
the Head

Welcome to the Robotics and Autonomous Systems

On behalf of the Robotics and Autonomous Systems (ROAS) Thrust, I would like to extend a warm welcome to all of you. We are excited to have you join our community of hardworking and dedicated individuals who share a passion for the field of robotics and autonomous systems.
At ROAS, our mission is to provide you with the knowledge, skills, and professional training necessary to excel in this transdisciplinary branch of engineering and science. We believe that designing and managing robotics and autonomous systems requires diverse skills from various engineering disciplines such as electronics, mechatronics, control and signal processing, together with state-of-the-art computer science such as software architecture, algorithms and data structures or artificial intelligence.
We are committed to providing you with the best possible education and training, so that you can pursue success in your chosen field. Our faculty members are experts in their respective fields and are dedicated to helping you achieve your goals. We encourage you to take advantage of the resources available to you, including our state-of-the-art facilities and equipment, as well as our extensive network of industry partners.
We believe that hard work, dedication, and a passion for learning are the keys to success in the field of robotics and autonomous systems. We are confident that with the right training and support, you will be able to achieve your goals and make a meaningful contribution to this exciting and rapidly evolving field.
Once again, welcome to the ROAS Thrust. We look forward to working with you and helping you achieve your full potential.

Ricky Shi-Wei LEE
ROAS Thrust

Introduction of the Head

Ricky Shi-Wei LEE

PhD in Aeronautical and Astronautical Engineering
Purdue University, 1992

Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Smart Manufacturing Thrust and Dean of Systems Hub at HKUST(GZ). He also has concurrent appointments as Executive Director of Shenzhen Platform Development Office, Director of Electronic Packaging Laboratory, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. Dr. Lee has been focusing his research on the technology development for electronics/optoelectronics packaging and additive manufacturing. His R&D activities cover wafer level packaging and heterogeneous integration, 3D printing for microsystems packaging, LED packaging for solid-state lighting and applications beyond lighting, lead-free soldering and reliability analysis. In addition to numerous technical papers in international journals and conference proceedings, Dr. Lee also co-authored 4 books and 10 book chapters. Dr. Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.