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李世玮
智能制造科技成果转化亮点

研究领域

The topics of Dr Lee’s R&D interests include wafer level packaging and heterogeneous integration, 3D printing for microsystems packaging, LED packaging for solid-state lighting and applications beyond lighting, lead-free soldering and reliability analysis.


开发了以UV-LED作为高效高速消毒细菌光源的工程方案

Based on deeply research and development in the field of LED technology for many years, we developed an engineering scheme using UV-LED as an efficient and high-speed disinfection and sterilization light source, and took wardrobe elimination as the application scenario. During the epidemic period, we made contributions to the fight against the epidemic and won the attention and recognition of the society. This case uses 265 nm wavelength LED as deep ULTRAVIOLET light source, develops an innovative design with laminated silicon reflective cup as the main packaging structure, and makes a prototype uV-LED array, which is installed in the self-designed wardrobe to achieve elimination function. By international professional certification company SGS test, can achieve in 1 minute sterilization 99.99% of the effectiveness, in the market all kinds of disinfection products crown.  Po Leung Kuk in Hong Kong has used it in three of its schools and held press conferences to publicize the results.

The relevant link: https://mp.weixin.qq.com/s/rU_nhDdpr3wWf2A47C3N-A